High-Purity Custom Profile Copper Targets (4N-6N)

Short Description:

Product Specifications
Name： Extruded High Purity Copper Shaped Sputtering Target
Standard： ASTM F68 (Oxygen-Free Electronic Copper), ASTM B115, Purity ≥99.99% (4N-6N), RoHS Compliant, REACH Compliant
Material： C10100 (OFHC Copper), C10200 (Oxygen-Free Copper), High Purity Cu (4N/5N/6N)
Surface： Precision Machined/Polished, Ra ≤0.5 μm, Optional Bonding to Backing Plate
Cross-Section： Custom Shaped Profiles (e.g., rectangular, tubular, stepped, or complex geometries)
Length： 500mm – 3500mm
Thickness/Width： 5mm – 200mm (depending on profile design)
Product Features: Ultra-high purity with controlled low impurities · Dense and uniform microstructure from extrusion process · Ability to form complex geometries not possible with standard machining · Excellent thermal and electrical conductivity · Consistent sputtering rate across shaped surfaces · High material utilization and film uniformity · Minimal defects and low particle generation
Application Field: Large-area thin-film solar panels, Architectural and automotive glass coatings, Flexible electronics and roll-to-roll deposition, Advanced optical filters and mirrors, Semiconductor barrier layers requiring shaped sources, Display backplanes and touch sensors, Decorative and functional coatings on irregular substrates, High-power magnetron systems with custom target designs

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Extruded High Purity Copper Shaped Sputtering Target – Process & Quality Assurance Statement

Our extruded copper shaped targets are specially produced for applications demanding intricate geometries and uniform deposition over non-standard surfaces, where conventional planar targets fall short.

Key process features

The extrusion-based manufacturing route ensures superior material properties and shape fidelity:
●High-Purity Starting Material: Selected electrolytic copper with verified low oxygen and impurity levels.
●Vacuum Melting & Alloying: Repeated vacuum induction melting achieves homogeneous composition at 4N-6N purity.
●Billet Preparation: Casting into cylindrical billets followed by homogenization for uniform grain.
●Hot Extrusion: Precision hot extrusion through custom dies forms complex cross-sections with excellent density and flow characteristics.
●Cold Working & Annealing: Controlled drawing and heat treatment refine structure and relieve stresses.
●Precision Finishing: CNC machining and surface polishing create smooth sputtering faces on all profile surfaces.
●Bonding Service: Optional low-melt indium bonding to compatible backing tubes or plates.
●Cleanroom Handling: Final cleaning and vacuum packaging prevent contamination.

Quality control system

● Full traceability from raw copper cathode to finished shaped target
● Comprehensive certification package included with every delivery
● Archive samples maintained ≥3 years for third-party analysis (SGS, BV, etc.)
● 100% inspection of vital attributes:
• Purity and elemental analysis (GDMS/ICP-MS; typical oxygen <5 ppm)
• Density verification (>99% theoretical via extrusion)
• Microstructure and grain uniformity (metallographic testing)
• Profile dimensional accuracy (3D CMM; tolerances ±0.1mm typical)
• Surface finish and defect-free condition (profilometer + visual checks)
● Internal standards exceed ASTM F68 requirements. Typical extruded properties: Superior conductivity >400 W/m·K, Excellent shape retention during sputtering, Consistent performance in complex magnetron configurations.
● Cleanroom-compatible operations and ISO 9001:2015 certified production guarantee reliable, high-performance targets tailored to your specialized coating needs.