High-Purity Copper Sputtering Targets – Square (4N-6N)

Short Description:

Product Specifications
Name： High Purity Copper Sputtering Target
Standard： ASTM F68 (Oxygen-Free Electronic Copper), ASTM B115, Purity ≥99.99% (4N-6N), RoHS Compliant, REACH Compliant
Material： C10100 (OFHC Copper), C10200 (Oxygen-Free Copper), High Purity Cu (4N/5N/6N)
Surface： Precision Ground/Polished, Ra ≤0.4 μm, Optional Indium/Tin Bonding to Backing Plate
Size Range： 100mm × 100mm to 600mm × 600mm (custom square dimensions) Thickness： 3mm – 50mm
Purity Level： 99.99% – 99.9999%
Product Features: Exceptional purity with low oxygen and impurity content · Superior thermal and electrical conductivity · Uniform grain structure for consistent sputtering · High density (>99.5% theoretical) · Excellent film adhesion and deposition uniformity · Low particle generation · Long target life and high utilization rate
Application Field: Semiconductor interconnect layers, Thin film solar cells (CIGS/CdTe), Flat panel displays (TFT-LCD), Optical coatings and mirrors, Decorative PVD coatings, Magnetic data storage, Aerospace and automotive components, Research and development laboratories

Send email to us

Product Detail

Product Tags

High Purity Copper Sputtering Target – Process & Quality Assurance Statement

Our square copper sputtering targets are manufactured to the exacting standards required for reliable thin-film deposition in advanced coating processes.
Production follows a tightly controlled vacuum-based workflow to maintain ultra-high purity and material consistency:
●Raw Material Selection: Only certified electrolytic copper cathodes (≥99.99%) are used as starting material.
●Vacuum Melting: Induction melting under high vacuum or inert atmosphere minimizes oxygen pickup and volatile impurities.
●Casting & Refining: Controlled directional solidification produces ingots with homogeneous composition and minimal segregation.
●Hot Working: Forging or hot pressing achieves near-theoretical density and refined grain structure.
●Precision Machining: CNC milling and grinding produce accurate square dimensions with flat, parallel surfaces.
●Surface Finishing: Multi-step polishing delivers mirror-like finish suitable for cleanroom use.
●Optional Bonding: Indium or elastomer bonding to molybdenum/copper backing plates available for thermal management.
●Final Cleaning & Packaging: Ultrasonic cleaning in ultra-pure water, followed by vacuum sealing in double-layer clean bags.

Quality Control System

● Full traceability from raw cathode lot to finished target
● Material certificates and test reports supplied with every shipment
● Retention of archive samples ≥3 years for third-party verification (SGS, BV, etc.)
● 100% inspection of critical parameters:
• Purity and impurities (GDMS/ICP-MS analysis; typical oxygen <10 ppm)
• Density measurement (Archimedes method; ≥99.5%)
• Grain size and microstructure (metallographic examination)
• Dimensional accuracy (CMM; flatness ≤0.05mm typical)
• Surface roughness and defects (profilometer + visual inspection)
● Internal specifications exceed ASTM F68 requirements. Typical properties: Thermal conductivity >390 W/m·K, Electrical resistivity <1.7 μΩ·cm, Consistent sputtering rate and film quality.
● Cleanroom-compatible processes and ISO 9001:2015 certified facility ensure every target meets the demanding needs of modern PVD applications.