— Specialized Continuous Plating Line for Large-Size Copper Busbars
Workshop Overview
The CYMBER electroplating workshop covers approximately 1,000 m² and is dedicated to high-reliability surface treatment of large copper busbars used in new energy, power distribution, rail transit, and industrial busbar applications. The facility operates a fully automatic horizontal continuous plating system. Unlike conventional rack-plating equipment, the production line is configured in long linear form with sequential process tanks beneath the moving busbars, enabling high-volume, uniform deposition on long workpieces.
Main Production Line Configuration
The workshop houses two independent continuous plating lines. One dedicated line is exclusively designed for tin and ion (silver/nickel) plating of long copper busbars. Key sections include:
● Pre-treatment Section (12–15 m) Chemical degreasing → rinse → acid activation → multi-stage rinsing Removes oil, oxides, and machining residues to ensure substrate cleanliness and activation.
● Main Tin Plating Section (~45 m) Utilizes a high-stability methanesulfonate-based bright tin process with current density of 3–25 A/dm², achieving uniform deposits of 3–30 μm. The coating exhibits excellent adhesion, fine grain structure, and superior solderability in accordance with IPC-4552A.
● Ion Plating Zone (Silver or Nickel) Equipped for cyanide-free silver plating and semi-bright/bright nickel plating. Typical silver thickness: 2–15 μm; nickel: 5–20 μm. Primarily applied to high-voltage switchgear and busbar joint surfaces requiring low contact resistance and high corrosion resistance.
● Post-treatment Section Multi-stage counterflow rinsing → hot DI water rinse → passivation/anti-tarnish → high-temperature drying → cooling and discharge.
● Supporting Systems Total rectifier capacity exceeds 1,200 kW, automatic dosing, continuous filtration, waste gas scrubbing towers, and a wastewater pre-treatment station achieving near-zero liquid discharge.
Process Characteristics & Advantages
● Horizontal continuous transport eliminates the need for racking fixtures, minimizing handling marks and enabling efficient processing of long bars (up to 6 m).
● Coating thickness uniformity within ±10% along the same bar (versus ±25–35% typical of rack plating).
● High current density capability up to 30 A/dm² supports both rapid production and thick deposits.
● Full PLC and HMI control with real-time monitoring and logging of critical parameters (current, line speed, bath chemistry, pH), providing complete production traceability upon request.
● Flexible changeover between tin, silver, and nickel processes on the same line in ≤4 hours.
Quality Assurance
● Daily bath analysis and 24/7 process parameter monitoring.
● 100% visual inspection + X-Ray thickness measurement + adhesion bend/thermal shock testing.
● Third-party test reports (salt spray, contact resistance, solderability, etc.) available per customer drawing requirements.
The CYMBER electroplating workshop delivers stable, traceable, and cost-effective surface treatment solutions for large-scale copper busbar applications, supporting the reliability and longevity requirements of high-end power connection systems.
Post time: Dec-10-2025